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ABSTRACT

The design process in power electronics is driven by increased utilisation level of the used components to gain performance whilst keeping cost low. This article provides an overview on challenges in low-voltage high-current systems, e.g. used in automotive applications. The main content points are: topology selection—single systems vs. cascaded systems, PCB manufacturing technology overview, current measurement methods, bulk capacitor design (ceramic DC link) and PCB design instructions for high-current systems. The PCB design instructions target on optimised thermal design for maximised PCB utilisation and on optimised track design for a low inductance DC link interconnection. The paper bases on calculations, measurements and simulations.

KEYWORDS

High current application, 48V system, DC link optimization, PCB optimization, current carrying capability.

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