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The Effect of Electrochemical Migration of Pb-free Sn-3.0Ag-0.5Cu Solder Reinforced by NiO Nanoparticles



Author(s)

Fakhrul Rifdi Omar¹, Emee Marina Salleh¹, Norinsan Kamil Othman¹, Fakhrozi Che Ani² and Zambri Samsudin²

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DOI:10.17265/2161-6213/2018.9-10.002

1. School of Applied Physics, Faculty of Science and Technology, Universiti Kebangsaan Malaysia, Bangi 43600, Selangor Darul Ehsan, Malaysia
2. Jabil Circuit Sdn. Bhd., Bayan Lepas Industrial Park, Penang 11900, Malaysia

As electronic devices continue to become lighter and thinner, they require much smaller solder joints and fine-pitch interconnections for microelectronic packaging. Pb-free solders incorporated with nano-sized particles have been identified as potential Pb-free nanocomposite solders that could provide higher microstructure stability and better mechanical properties than the conventional solders. The present study investigates the effects of NiO addition on the mechanical properties and microstructure of the Sn-3.0Ag-0.5Cu (SAC305) solder alloy. In this study, three different solder alloys were prepared by reflow soldering. Sn-3.0Ag-0.5Cu (SAC 305) solder alloys were doped with different percentage of NiO (nickel oxide) nanoparticles content; i.e. 0.01 wt%, 0.05 wt%, and 0.15 wt% in producing nanocomposite solder paste. Morphology refinement of SAC305-NiO nanocomposite solder contributed to the enhancement of mechanical properties in the field of microelectronic industries. ECM (electrochemical migration) of SAC-NiO nanocomposites solder pastes was measured using a WDT (water drop test). Effects of electrochemical migration of its surface morphology were investigated using OM (optical microscopy).

SAC305, NiO nanoparticle, microstructure, corrosion, dendrite.