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Article
Author(s)
Takashi Fukue, Koichi Hirose, Hidemi Shirakawa, Jun Suzuki and Yosuke Saga
Full-Text PDF XML 676 Views
DOI:10.17265/2159-5275/2016.08.001
Affiliation(s)
ABSTRACT
This study focuses on a development of heat transfer enhancement techniques using pulsating flow for thermal equipment such as electronic equipment and heat exchangers. In this report, the heat transfer performance of the pulsating airflow around the heating pillar mounted in the rectangular enclosure was investigated experimentally while changing the size of the clearance between the enclosure wall and the pillar. The pillar simulates the components mounted in thermal equipment such as fins and electrical components. The rectangular enclosure simulates an enclosure of electronic equipment and heat exchangers. The shape of the cross section of the pillar was square having sides 30 mm. The dimension of the width of the enclosure was changed from 50 mm to 80 mm. It was found that the heat transfer performance of the pulsating airflow became higher than that of the steady flow regardless of the dimension of the clearance. The heat transfer enhancement around heating components by the pulsating flow can be available regardless of the clearance around the components.
KEYWORDS
Forced convection, heat transfer enhancement, pulsating flow, thermal management.
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