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This work is licensed under a Creative Commons Attribution-NonCommercial 4.0 International License
Article
Nano-Structured Cu/W Brazing Fillers for Advanced Joining Applications
Author(s)
Frank Moszner1, Claudia Cancellieri1*, Christoph Becker2, Mirco Chiodi1, Jolanta Janczak-Rusch1 and Lars P. H. Jeurgens1
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DOI:10.17265/2161-6221/2016.9-10.003
Affiliation(s)
1. Empa, Swiss Federal Laboratories for Materials Science and Technology, Überlandstrasse 129, CH-8600 Dübendorf, Switzerland
2. Institute of Virtual Manufacturing (IvP), ETH Zurich, Tannenstrasse 3, CH-8092 Zurich, Switzerland
ABSTRACT
Nano-multilayered brazing fillers offer a high potential for joining heat sensitive materials at reduced temperatures. In the current work Cu/W based nano-multilayered coatings, fabricated via physical vapor deposition (PVD) are studied. Joints were successfully produced via deformation dilatometry at temperature of 750 ºC and a mechanism for the bonding process is suggested. The promising results indicate an attractive pathway for using the versatile ability of PVD to precisely control the microstructure on the nm-scale and enabling tunable joint properties.
KEYWORDS
Microstructure, joining, brazing, nano-structures, Cu/W nano-multilayers, thin films.
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